SMF05T1
Quad Array for ESD
Protection
ESD Protection Diodes with Low
Clamping Voltage
This quad monolithic silicon voltage suppressor is designed for
G
1 2 3
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
Specification Features
? Low Clamping Voltage
? Stand Off Voltage 5 V
? Low Leakage < 5 m A @ 5 V
? SC ? 88A Package Allows Four Separate Unidirectional
Configurations
? IEC6100 ? 4 ? 2 Level 4 ESD Protection
? Pb ? Free Packages are Available*
Mechanical Characteristics
? Void Free, Transfer ? Molded, Thermosetting Plastic Case
? Corrosion Resistant Finish, Easily Solderable
? Package Designed for Optimal Automated Board Assembly
? Small Package Size for High Density Applications
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
http://onsemi.com
MARKING
DIAGRAM
4 5
60 M G
SC ? 88A/SOT ? 323
CASE 419A
STYLE 5
60 = Device Marking
M = One Digit Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
1 5
Cathode Cathode
2
Anode
3 4
Cathode Cathode
Characteristic
Symbol
Value
Unit
Peak Power Dissipation @ 8 X 20 m s
@T A ≤ 25 ° C
Steady State Power ? 1 Diode
(Note 1)
P pk
P D
200
385
W
mW
ORDERING INFORMATION
Device Package Shipping ?
SMF05T1 SC ? 88A 3000/Tape & Reel
Thermal Resistance
Junction ? to ? Ambient
Above 25 ° C, Derate
R q JA
325
3.1
° C/W
mW/ ° C
SMF05T1G
SC ? 88A
(Pb ? Free)
3000/Tape & Reel
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
ESD Discharge
IEC61000 ? 4 ? 2, Air Discharge
IEC61000 ? 4 ? 2, Contact Discharge
Lead Solder Temperature
(10 seconds duration)
T Jmax
T J T stg
T L
150
? 55 to +150
30
30
260
° C
° C
kV
° C
SMF05T2G SC ? 88A 3000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Only 1 diode under power. For all 4 diodes under power, P D will be 25%.
Mounted on FR ? 4 board with min pad.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2009
August, 2009 ? Rev. 4
1
Publication Order Number:
SMF05T1/D
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